Alkyl methyl silicone phase change materials for thermal interface applications

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn 2002-January, Issue , 2002, Pages 485-488

  Zhang, S M ^a   Swarthout, D ^a   Feng, Q J ^a   Petroff, L ^a   Noll, T ^a   Gelderbloom, S ^a   Houtman, D ^a   Wall, K ^a  

^a DOW CORNING CORPORATION   (United States)

Author keywords

Aluminum oxide; Bonding; Impedance; Organic materials; Phase change materials; Polymers; Temperature; Testing; Thermal conductivity; Viscosity

Indexed keywords

ALUMINUM; BONDING; ELECTRIC IMPEDANCE; FILLERS; INTERFACES (MATERIALS); MATERIALS TESTING; ORGANIC POLYMERS; OXIDES; PHASE INTERFACES; POLYMERS; SILICONES; SYNTHESIS (CHEMICAL); TEMPERATURE; TESTING; THERMAL CONDUCTIVITY; THERMAL INSULATING MATERIALS; VISCOSITY;

ALUMINUM OXIDES; BULK THERMAL CONDUCTIVITY; INTERFACIAL RESISTANCES; MEASUREMENT METHODS; OPERATION TEMPERATURE; ORGANIC MATERIALS; THERMAL INTERFACE MATERIALS; THERMALLY CONDUCTIVE FILLERS;

PHASE CHANGE MATERIALS;

EID: 4444378035     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2002.1012495     Document Type: Conference Paper

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