Thermal residual stress modeling in ain and gan multi layer samples

Materials Research Society Symposium - Proceedings

Volumn 537, Issue , 1999, Pages

  Wang, Kai ^a   Reeber, Robert R ^a  

^a North Carolina State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC PROPERTIES; ELECTRONIC PROPERTIES; EPITAXIAL GROWTH; FINITE ELEMENT METHOD; MULTILAYERS; NITRIDES; RESIDUAL STRESSES; SEMICONDUCTING ALUMINUM COMPOUNDS; SEMICONDUCTING GALLIUM COMPOUNDS; THERMAL EFFECTS; THERMAL EXPANSION; THICKNESS CONTROL;

RESIDUAL STRESS DISTRIBUTION; THERMAL RESIDUAL STRESS; THICKNESS EFFECTS;

SEMICONDUCTING FILMS;

EID: 4444333668     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

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