Full-wave characterization of RF ceramic packages

Conference Proceedings - 33rd European Microwave Conference, EuMC 2003

Volumn 2, Issue , 2003, Pages 635-638

  Schuh, Patrick ^a   Bilzer, Horst ^a   Menzel, Wolfgang ^a   Kiwitt, Jurgen ^c   Pitschi, Maximilian ^b  

^a UNIVERSITY OF ULM   (Germany)

^b EWS MicroWave Factory   (Germany)

^c EPCOS AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; MICROWAVE CIRCUITS;

CERAMIC PACKAGE; CHIP DESIGN PROCESS; FULL WAVES; FULL-WAVE SIMULATIONS; IMMEDIATE ENVIRONMENT; RADIO FREQUENCIES; RF DEVICES; SIMULATIONS AND MEASUREMENTS;

ELECTRIC PROPERTIES;

EID: 4444323450     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EUMC.2003.1262970     Document Type: Conference Paper

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