LMDS applications and RF radio links go for SMD based module technology - Reality, experience and future trends

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4931, Issue , 2002, Pages 273-278

  Oppermann, Martin ^a  

^a AIRBUS GROUP INNOVATIONS   (Germany)

Author keywords

LMDS communications; RF microwave Wireless; Strategies; Technology trends

Indexed keywords

ELECTRONICS PACKAGING; FREQUENCY ALLOCATION; MARKETING; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; RADIO LINKS; TECHNOLOGICAL FORECASTING; TELECOMMUNICATION INDUSTRY;

LOCAL MULTIPOINT DISTRIBUTION SYSTEMS; MULTILAYER CERAMIC TECHNOLOGY; POINT TO MULTIPOINT RADIO; POINT TO POINT RADIO;

SURFACE MOUNT TECHNOLOGY;

EID: 0036448338     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Private discussions with Don Brown, Director International Wireless Packaging Consortium, IWPC, Providence (RI), USA, May 2002
2. Mark Christensen and partners, The Prismark Wireless Technology Report, issue Jan 2002
3. HEI Broadband HEI Inc., A DC to 50 GHz and Beyond MMIC carrier, Microwave Journal, Sep 2001
4. IWPC Workshop, Ka-Band Broadband Satellite Terminals, Rome, Italy, Feb 2002
5. J. Mueller, et al., Embedded Capacitors for LTCC applications above 20 GHz, in proceedings: IMAPS Advanced Technology Workshop, Providence (RI), USA, May, 2002