Flip chip die cracking - A simplified approach utilizing experimentation and simulations

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 2002, Pages 876-883

  Chengalva, Mahesh K ^a  

^a DELPHI CORPORATION   (United States)

Author keywords

Bend testing; Die strength; Experimental methods; Finite Element analysis; Fracture; Parametric modeling; Silicon failure

Indexed keywords

COMPUTER SIMULATION; CONTROL EQUIPMENT; CRACK INITIATION; DIES; ELECTRONICS INDUSTRY; FINITE ELEMENT METHOD; RESIDUAL STRESSES; SILICON; STRENGTH OF MATERIALS;

THERMAL CONTRACTION;

FLIP CHIP DEVICES;

EID: 0036457652     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Kanninen, M.F., Popelar, C.H., Advanced Fracture Mechanics, Oxford University Press, 1985.
2. Chengalva, M.K., "Preliminary Evaluation of Silicon Wafer Strength using Four Point Bend Tests", Delphi Automotive Systems Internal Report, April 1997.
3. Popelar, S.F., "An Investigation Into the Fracture of Silicon Die Used in Flip Chip Applications", Proceedings of the 1998 International Symposium on Advanced Packaging Materials, Braselton, GA, March 1998, pp. 41-48.
4. Leung, B., Guo, Y., Sarihan, V., "Die Strength Evaluation in the Presence of Edge Cracks", Proceedings of the 1997 American Society of Mechanical Engineers Conference Application of Fracture Mechanics in Electronic Packaging, Dallas, TX, Nov. 1997, pp. 125-131.
5. ABAQUS Version 5.8, Hibbitt, Karlsson & Sorensen, Inc. (www.hks.com), 1998.
6. PATRAN Version 8.0, MacNeal-Schwendler Corp. (www.mscsoftware.com), 2000.
7. Chengalva, M.K., Agarwal, R.K., "Chip Capacitor Cracking Due to Printed Circuit Board Flexure", Experimental/Numerical Mechanics in Electronics Packaging, Volume 1, Society of Experimental Mechanics, pp. 102-107.