A comparative study of the performance of compact model topologies and their implementation in CFD for a Plastic Ball Grid Array package

Journal of Electronic Packaging

Volumn 123, Issue 3, 2001, Pages 232-237

  Shidore, Sarang ^a   Lee, Tien Yu Tom ^b  

^a Flomerics Inc   (United States)

^b MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0039563563     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1349423     Document Type: Article

References (11)

1. Dutta, V. B., 1988, "Junction-to-Case Thermal Resistance - Still a Myth?" Proc. 4th IEEE SEMITHERM Symposium, pp. 8-11.
2. Rosten, H., and Lasance, C. J. M., 1994, "The Development of Libraries of Thermal Models of Electronics Components for an Integrated Design Environment," Proc. IEPS Conference, pp. 138-147.
3. Rosten, H., 1996, "DELPHI - A Status Report on the European-funded Project for the Development of Libraries and Physical Models for an Integrated Design Environment," Proc. Of 46th Electronic Components & Technology Conference, pp. 172-185.
4. Parry, J., Rosten, H., and Kromann, G., 1996, "The Development of Component-level Thermal Compact Models of a C4/CBGA Interconnect Technology: the Motorola Power PC 603 and Power PC 604 RISC Microprocessors," IEEE Trans. Compon., Packag. Manuf. Technol., Part A 21, No. 1, pp. 104-112.
5. Joiner, B. and Adams, V., 1999, "Measurement and Simulation of Junction to Board Thermal Resistance and Its Application in Thermal Modeling, Proc. of 15th SEMITHERM, pp. 212-220.
6. JEDEC MO-163, 1994, Rectangular Plastic Ball Grid Array, 1.27 mm. Pitch.
7. Shidore, S., and Kromann, G., 1997, "Development of Optimized Component-Level Thermal Behavioral Models of a Plastic Ball Grid Array Interconnect Technology for Air-Cooled Applications," Proc. of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference, INTERpack'97, Vol. 1, pp. 981-988.
8. FLOPACK User Documentation, 1999, http://www.flopack.com. Flomerics Inc.
9. FLOTHERM User Documentation, 1999, Flomerics Inc.
10. Lasance, C. J. M., Hertog, P., and Stehouwer, P., 1999, "Creation and Evaluation of Compact Models for Thermal Characterization Using Dedicated Optimization Software," Proc. of 15th SEMITHERM, pp. 189-200.
11. SOLCOND User's Guide, 1998, Flomerics Inc. Internal Document.