Emerging MOSFET packaging technologies and their thermal evaluation

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn 2002-January, Issue , 2002, Pages 1102-1108

  Fan, Xuejun ^a   Haque, S ^a  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

Bonding; Cooling; Costs; Flip chip; Lead; Manufacturing; MOSFET circuits; Packaging; Technological innovation; Thermal factors

Indexed keywords

BONDING; CHIP SCALE PACKAGES; COOLING; COSTS; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; LEAD; MANUFACTURE; PACKAGING; SOLDERED JOINTS;

FLIP CHIP; MOSFET CIRCUITS; PACKAGING TECHNOLOGIES; TECHNOLOGICAL INNOVATION; THERMAL EVALUATIONS; THERMAL FACTORS; THERMAL PERFORMANCE; UNDERFILL MATERIALS;

MOSFET DEVICES;

EID: 84950147830     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2002.1012581     Document Type: Conference Paper

References (19)

1. D. Hollander, "Trends in Discrete Surface Mount Packaging", Motorola Inc., Power Pulse, 1999.
2. J. Hjerpe, "Power Distribution for High-Performance Processors", High Density Interconnects, October 2000, pp. 22-24.
3. th Annual VPEC Seminar, Blacksburg, VA, September 1997, pp. 107-114.
4. J.H. Lau, Flip Chip Technologies, McGraw Hill, 1995.
5. R.R. Tummala, E.J. Rymaszewski and A.G. Klopfenstein, Microelectronics Packaging Handbook, Chapman & Hall, 1996.
6. M.J. Kuzawinski, "The Limits of Wirebond Technology: Is Flipchip Attach Now a Prerequisite for Advanced Packaging?", IBM Microelectronics, Fourth Quarter, 2000.
7. C. Bull, "Trends in Power Semiconductor Packaging", ECN magazine, 2000.
8. P. Mannion, "MOSFETs Break Out of the Shackles of Wirebonding", Planet EE, March, 1999.
9. J. Klein, "New MOSFET Packaging Technology Enables Higher Current DC/DC Converters", ECN magazine, October 2000, pp 65-66.
10. J. Klein and A. Wong, "New MOSFET Packaging Increases Power Density", Nikkei Electronics Asia, February, 2001.
11. M. Speed and W. McDaniel, New power MOSFET packages cut DC-DC converter size, PCIM, June 2001
12. T. Simmon, H. Schofield, A. Arzumanyan and D. Kinzer, "A New Generation of Wafer Level Packaged HEXFET Devices", International Rectifier.
13. Siliconix Introduces MICRO FOOT, News Release, 20 November, 2000, Vishay Press Release, Vishay-Siliconix web site.
14. R. Joshi, H. Granada and C. Tangpuz, "MOSFET BGA Package", Proceedings of the IEEE-ECTC Conference, 2000, pp. 944-947.
15. IP2001, Provisional Data Sheet, International Rectifier.
16. D. Morrison, "Smart Power Blocks Build New Approach to DC-DC Conversion", Electronic Design, February 19, 2001.
17. A. Sawle, M. Standing, T. Sammon and A. Woodworth, "DirectFET - A Proprietary New Source Mounted Power Package for Board Mounted Power", Proceedings of PCIM Conference, Nuremberg, 2001.
18. MicroLeadFrame Package, Amkor Technology, www.amkor.com.
19. PIP201-12M DC to DC Converter Power Output Stage, Data Sheet, Philips Semiconductors, 2001.