A method for calculating surface stress and surface elastic constants by molecular dynamics: Application to the surface of crystal and amorphous silicon

Thin Solid Films

Volumn 467, Issue 1-2, 2004, Pages 253-260

  Izumi, S ^a   Hara, S ^a   Kumagai, T ^a   Sakai, S ^a  

^a UNIVERSITY OF TOKYO   (Japan)

Author keywords

Elastic properties; Molecular dynamics; Silicon; Surface stress

Indexed keywords

ATOMIC ELASTIC CONSTANTS; ELASTIC PROPERTIES; NANO-SCALE THIN FILMS; SURFACE ELASTIC CONSTANTS;

AMORPHOUS SILICON; CRYSTALLINE MATERIALS; CRYSTALS; DEFORMATION; MATHEMATICAL MODELS; MICROSTRUCTURE; MOLECULAR DYNAMICS; SEMICONDUCTOR MATERIALS; SURFACE TENSION; TENSORS;

THIN FILMS;

EID: 4444251588     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.03.034     Document Type: Article

References (17)

1. Koch R. J. Phys., Condens. Matter. 6:1994;9519.
2. Hara S., Izumi S., Sakai S. Atluri S.N., Pepper D.W. Proceedings of International Conference on Computational Engineering and Sciences. July 31-August 3, 2002;131 Tech. Science Press, Rino, U.S.A.
3. Petersen K.E., Guarnieri C.R. J. Appl. Phys. 50:1979;6761.
4. Matsuoka S., Miyahara K., Nagashima N., Tanaka K. Trans. Jpn. Soc. Mech. Eng. 62:1996;134. (in Japanese).
5. Wolf D., Lutsko J. Phys. Rev. Lett. 60:1988;1170.
6. Martin J.W. J. Phys. C. 8:1975;2858.
7. Izumi S., Sakai S. JSME Int. J. Ser. A. 47:2004;54.
8. Tersoff J. Phys. Rev., B. 38:1988;9902.
9. Cook S., Clancy P. Phys. Rev., B. 47:1993;7686.
10. Ishimaru M., Munetoh S., Motooka T. Phys. Rev., B. 56:1997;15133.
11. Ishimaru M. J. Appl. Phys. 91:2002;686.
12. Ishimaru M., Yoshida K., Motooka T. Phys. Rev., B. 53:1996;7176.
13. Hadjisavvas G., Kopidakis G., Kelires P. Phys. Rev., B. 64:2001;125413.
14. Justo J., Bazant M., Kaxira E., Bulatov V., Yip S. Phys. Rev., B. 58:1998;2539.
15. Stillinger F., Weber T. Phys. Rev., B. 31:1985;5262.
16. Bazant M., Kaxiras E., Justo J. Phys. Rev., B. 56:1997;8542.
17. Marqués L., Pelaz L., Hernandez J., Barbolla J., Gilmer G. Phys. Rev., B. 64:2001;45214.