Polymers below the critical molecular weight for thermal imprint lithography

Microelectronic Engineering

Volumn 85, Issue 5-6, 2008, Pages 825-829

  Bogdanski, Nicolas ^a   Wissen, Matthias ^a   Möllenbeck, Saskia ^a   Scheer, Hella Christin ^a  

^a UNIVERSITY OF WUPPERTAL   (Germany)

Author keywords

Critical molecular weight; Hot embossing; Nanoimprint; Recovery

Indexed keywords

LITHOGRAPHY; MOLECULAR WEIGHT; OPTICAL MICROSCOPY; POLYSTYRENES; TEMPERATURE DISTRIBUTION;

HOT EMBOSSING; PARTIAL CAVITY FILLING; THERMAL IMPRINTS;

ELECTRIC LOADS;

EID: 44149125099     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2008.01.069     Document Type: Article

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