Equalising stamp and substrate deformations in solid parallel-plate UV-based nanoimprint lithography

Microelectronic Engineering

Volumn 85, Issue 5-6, 2008, Pages 822-824

  Bergmair, Iris ^a,b   Mühlberger, Michael ^a   Gusenbauer, Markus ^a   Schöftner, Rainer ^a   Hingerl, Kurt ^b  

^a PROFACTOR GMBH   (Austria)

^b INSTITUTE FOR MICROELECTRONICS   (Austria)

Author keywords

Compliant layer; Deformation; Finite element simulation; UV NIL

Indexed keywords

COMPUTER SIMULATION; DEFORMATION; FINITE ELEMENT METHOD; NANOIMPRINT LITHOGRAPHY; SPIN COATING;

COMPLIANT LAYER; SOLID STAMP; SPIN COATED SUBSTRATES;

SUBSTRATES;

DEFORMATION; LITHOGRAPHY; SUBSTRATES;

EID: 44149113317     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2007.12.079     Document Type: Article

References (4)

1. Vogler M., et al. Microelectronic Engineering 84 (2007) 984
2. Gao H., et al. Nano Letters 6 (2006) 2438
3. Hiroshima H. Japanese Journal of Applied Physics 45 (2006) 5602
4. Mühlberger M., et al. Microelectronic Engineering 84 (2007) 925