Properties and microstructures of low-temperature-processable ultralow-dielectric porous polyimide films

Journal of Electronic Materials

Volumn 37, Issue 7, 2008, Pages 955-961

  Ren, Yuxing ^a   Lam, David C C ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

High frequency; Low k; Packaging; Polyimide; Porous

Indexed keywords

LOW TEMPERATURE EFFECTS; MICROSTRUCTURE; PHASE SEPARATION; POLYIMIDES; SCANNING ELECTRON MICROSCOPY;

KAPTON SUBSTRATE; POROUS POLYIMIDE FILMS; SKIN LAYERS;

DIELECTRIC FILMS;

EID: 43749117300     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0446-z     Document Type: Article

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