-
3
-
-
0004005306
-
-
2nd ed. New York: Wiley-Interscience
-
S. M. Sze, Physics of Semiconductor Devices, 2nd ed. New York: Wiley-Interscience, 1981, pp. 304-307.
-
(1981)
Physics of Semiconductor Devices
, pp. 304-307
-
-
Sze, S.M.1
-
4
-
-
11044238778
-
2-polycrystalline silicon structures
-
Dec
-
2-polycrystalline silicon structures," J. Appl. Phys., vol. 96, no. 12, pp. 7568-7573, Dec. 2004.
-
(2004)
J. Appl. Phys
, vol.96
, Issue.12
, pp. 7568-7573
-
-
van Dal, M.J.H.1
Jawarani, D.2
van Berkum, J.G.M.3
Kaiser, M.4
Kittl, J.A.5
Vrancken, C.6
de Potter, M.7
Lauwers, A.8
Maex, K.9
-
5
-
-
43749087942
-
-
Online, Available
-
The International Technology Roadmap for Semiconductors, 2006. [Online]. Available: Http://www.itrs.net/Links/2006Update
-
(2006)
-
-
-
6
-
-
0035519420
-
Materials aspects, electrical performance, and scalability of Ni silicide towards sub-0.13 μm technologies
-
Nov./Dec
-
A. Lauwers, A. Steegen, M. de Potter, R. Lindsay, A. Satta, H. Bender, and K. Maex, "Materials aspects, electrical performance, and scalability of Ni silicide towards sub-0.13 μm technologies," J. Vac. Sci. Technol. B, Microelectron. Process. Phenom., vol. 19, no. 6, pp. 2026-2037, Nov./Dec. 2001.
-
(2001)
J. Vac. Sci. Technol. B, Microelectron. Process. Phenom
, vol.19
, Issue.6
, pp. 2026-2037
-
-
Lauwers, A.1
Steegen, A.2
de Potter, M.3
Lindsay, R.4
Satta, A.5
Bender, H.6
Maex, K.7
-
7
-
-
0036133199
-
NiSi salicide technology for scaled CMOS
-
Jan
-
H. Iwai, T. Ohguro, and S. Ohmi, "NiSi salicide technology for scaled CMOS," Microelectron. Eng., vol. 60, no. 1, pp. 157-169, Jan. 2002.
-
(2002)
Microelectron. Eng
, vol.60
, Issue.1
, pp. 157-169
-
-
Iwai, H.1
Ohguro, T.2
Ohmi, S.3
-
8
-
-
10644282991
-
Ni based silicides for 45 nm CMOS and beyond
-
Dec
-
A. Lauwers, J. A. Kittl, M. J. H. van Dal, O. Chamirian, M. A. Pawlak, M. de Potter, R. Lindsay, T. Rayrnakers, X. Pages, B. Mebarki, T. Mandrekar, and K. Maex, "Ni based silicides for 45 nm CMOS and beyond," Mater. Sci. Eng. B, Solid-State Mater. Adv. Technol., vol. 114/115, pp. 29-41, Dec. 2004.
-
(2004)
Mater. Sci. Eng. B, Solid-State Mater. Adv. Technol
, vol.114-115
, pp. 29-41
-
-
Lauwers, A.1
Kittl, J.A.2
van Dal, M.J.H.3
Chamirian, O.4
Pawlak, M.A.5
de Potter, M.6
Lindsay, R.7
Rayrnakers, T.8
Pages, X.9
Mebarki, B.10
Mandrekar, T.11
Maex, K.12
-
9
-
-
0032157593
-
Stability of NiSi in boron-doped polysilicon lines
-
Sep
-
M. C. Poon, M. Chan, W. Q. Zhang, F. Deng, and S. S. Lau, "Stability of NiSi in boron-doped polysilicon lines," Microelectron. Reliab., vol. 38, no. 9, pp. 1499-1502, Sep. 1998.
-
(1998)
Microelectron. Reliab
, vol.38
, Issue.9
, pp. 1499-1502
-
-
Poon, M.C.1
Chan, M.2
Zhang, W.Q.3
Deng, F.4
Lau, S.S.5
-
10
-
-
0035737141
-
Nickel silicide as a contact material for submicron CMOS devices
-
Dec
-
D. Z. Chi, D. Mangelinck, A. S. Zuruzi, A. S. W. Wong, and S. K. Lahiri, "Nickel silicide as a contact material for submicron CMOS devices," J. Electron. Mater., vol. 30, no. 12, pp. 1483-1488, Dec. 2001.
-
(2001)
J. Electron. Mater
, vol.30
, Issue.12
, pp. 1483-1488
-
-
Chi, D.Z.1
Mangelinck, D.2
Zuruzi, A.S.3
Wong, A.S.W.4
Lahiri, S.K.5
-
11
-
-
0036776680
-
Silicides for the 100-nm node and beyond: Co-silicide, Co(Ni)-silicide and Ni-silicide
-
Oct
-
A. Lauwers, M. de Potter, O. Chamirian, R. Lindsay, C. Demeurisse, C. Vrancken, and K. Maex, "Silicides for the 100-nm node and beyond: Co-silicide, Co(Ni)-silicide and Ni-silicide," Microelectron. Eng. vol. 64, no. 1-4, pp. 131-142, Oct. 2002.
-
(2002)
Microelectron. Eng
, vol.64
, Issue.1-4
, pp. 131-142
-
-
Lauwers, A.1
de Potter, M.2
Chamirian, O.3
Lindsay, R.4
Demeurisse, C.5
Vrancken, C.6
Maex, K.7
-
12
-
-
0020201777
-
A direct measurement of interfacial contact resistance
-
Oct
-
S. J. Proctor and L. W. Linholm, "A direct measurement of interfacial contact resistance," IEEE Electron Device Lett., vol. EDL-3, no. 10, pp. 294-296, Oct. 1982.
-
(1982)
IEEE Electron Device Lett
, vol.EDL-3
, Issue.10
, pp. 294-296
-
-
Proctor, S.J.1
Linholm, L.W.2
-
13
-
-
0022874937
-
A two-dimensional analytical model of the cross-bridge Kelvin resistor
-
Dec
-
T. A. Schreyer and K. C. Saraswat, "A two-dimensional analytical model of the cross-bridge Kelvin resistor," IEEE Electron Device Lett., vol. EDL-7, no. 12, pp. 661-663, Dec. 1986.
-
(1986)
IEEE Electron Device Lett
, vol.EDL-7
, Issue.12
, pp. 661-663
-
-
Schreyer, T.A.1
Saraswat, K.C.2
-
14
-
-
49149141662
-
Specific contact resistance using a circular transmission-line model
-
May
-
G. K. Reeves, "Specific contact resistance using a circular transmission-line model," Solid State Electron., vol. 23, no. 5, pp. 487-490, May 1980.
-
(1980)
Solid State Electron
, vol.23
, Issue.5
, pp. 487-490
-
-
Reeves, G.K.1
-
15
-
-
0020140815
-
Contact resistance and methods for its determination
-
Jun
-
S. S. Cohen, "Contact resistance and methods for its determination," Thin Solid Films, vol. 104, no. 3/4, pp. 361-379, Jun. 1983.
-
(1983)
Thin Solid Films
, vol.104
, Issue.3-4
, pp. 361-379
-
-
Cohen, S.S.1
-
16
-
-
0023310553
-
Titanium disilicide contact resistivity and its impact on 1-μm CMOS circuit performance
-
Mar
-
D. B. Scott, R. A. Chapman, C. C. Wei, S. S. Mahantshetti, R. A. Haken, and T. C. Holloway, "Titanium disilicide contact resistivity and its impact on 1-μm CMOS circuit performance," IEEE Trans. Electron. Devices, vol. ED-34, no. 3, pp. 562-574, Mar. 1987.
-
(1987)
IEEE Trans. Electron. Devices
, vol.ED-34
, Issue.3
, pp. 562-574
-
-
Scott, D.B.1
Chapman, R.A.2
Wei, C.C.3
Mahantshetti, S.S.4
Haken, R.A.5
Holloway, T.C.6
-
18
-
-
33749505372
-
-
N. Stavitski, M. J. H. van Dal, R. A. M. Wolters, A. Y. Kovalgin, and J. Schmitz, Specific contact resistance measurements of metal-semiconductor junctions, in Proc. IEEE ICMTS, Austin, TX, 2006, pp. 13-17.
-
N. Stavitski, M. J. H. van Dal, R. A. M. Wolters, A. Y. Kovalgin, and J. Schmitz, "Specific contact resistance measurements of metal-semiconductor junctions," in Proc. IEEE ICMTS, Austin, TX, 2006, pp. 13-17.
-
-
-
-
19
-
-
0026925656
-
Shallow junctions, silicide requirements and process technologies for sub 0.5 μm CMOS
-
Sep
-
B. Davari, "Shallow junctions, silicide requirements and process technologies for sub 0.5 μm CMOS," Microelectron. Eng., vol. 19, no. 1-4, pp. 649-656, Sep. 1992.
-
(1992)
Microelectron. Eng
, vol.19
, Issue.1-4
, pp. 649-656
-
-
Davari, B.1
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