Evolution of Cu electro-deposition technologies for 45nm and beyond

2006 International Interconnect Technology Conference, IITC

Volumn , Issue , 2006, Pages 175-177

  Shue, Winsion S ^a  

^a TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; COPPER ALLOYS; ELECTROCHEMICAL SENSORS; ELECTROCHROMIC DEVICES; ELECTROOPTICAL DEVICES; REDUCTION;

COPPER METALLIZATION; ELECTRODE POSITIONING; FUTURE GENERATIONS; INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE; MANUFACTURABILITY; POSSIBLE SOLUTIONS;

TECHNOLOGY;

EID: 43749091320     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2006.1648680     Document Type: Conference Paper

References (12)

1. M.S. Liang, Tech. Dig. Of IEDM, pp.313 (2004)
2. J. Reid, Jpn. J. Appl. Phys. 40, 2650 (2001)
3. P.C. Andricacos, et al. IBM J. Res. Dev., 42, 567(1998).
4. R.D. Mikkola, et al, IEEE, IITC (2000)
5. S. Johnston, et al. Adv. Metal. Conf., p.49 (2003)
6. C. Bureau, et al, J. Surf. Anal., 6(2), p. 159 (1999)
7. C.H. Shih, et al, Tech. Dig. Of IEDM, pp.337 (2004)
8. C.H. Shin, et al, IEEE, IITC, pp. 102 (2005)
9. T. Ogawa, et al., IRPS, pp.312 (2002)
10. T. Itabashi, et al., IEEE, HTC, pp. 285 (2002)
11. T.C. Ko, et al., Symp. on VLSI Tech., pp. 109 (2003)
12. T. Decorps, et al., Adv. Metal. Conf., (2004)