Challenges in Cu/low-K integration

Technical Digest - International Electron Devices Meeting, IEDM

Volumn , Issue , 2004, Pages 313-316

  Liang, Mong Song ^a  

^a TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM COMPOUNDS; AMINES; CHEMICAL VAPOR DEPOSITION; COPPER; DENSITY (SPECIFIC GRAVITY); ETCHING; LOW TEMPERATURE EFFECTS; OPTIMIZATION; PHYSICAL VAPOR DEPOSITION; REDUCTION; RELIABILITY; SILICON; TENSILE STRESS; THERMAL EXPANSION;

BEOL MATERIALS; COEFFICIENT OF THERMAL EXPANSION (CTE); NETWORK BONDING; STRAIN ENERGY;

DIELECTRIC MATERIALS; RELIABILITY;

BEOL MATERIALS; ELECTRICAL RELIABILITY; INTEGRATED MODULE; MANUFACTURABILITY; MASS PRODUCTION; MATCHINGS; OPTIMISATIONS; REDUCTION TARGETS; RELIABILITY ROBUSTNESS; THERMAL AND MECHANICAL PROPERTIES;

EID: 21644443664     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. TI Bao et al., Tech. Dig. of IEDM, pp.583 (2002)
2. L.P.Li et.al., Symp. on VLSI Tech., pp.105 (2003)
3. KC Lin., Symp. On VLSI Tech., pp. 66 (2004)
4. CH Peng et.al., Tech. Dig. of IEDM, pp.603 (2002)