A CFD-based experimental analysis on the effect of free stream cooling on the performance of micro processor heat sinks

International Communications in Heat and Mass Transfer

Volumn 35, Issue 6, 2008, Pages 771-778

  Ismail, M A ^a   Abdullah, M Z ^a   Mujeebu, M A ^a  

^a SCHOOL OF CHEMICAL ENGINEERING   (Malaysia)

Author keywords

Force convection; Heat sinks; Nusselt number; Reynolds number

Indexed keywords

COMPUTER SIMULATION; COOLING; FLOW FIELDS; FORCED CONVECTION; HEAT SINKS; NUSSELT NUMBER; REYNOLDS NUMBER; TEMPERATURE DISTRIBUTION;

SOFTWARE PACKAGE FLUENT 6.2;

COMPUTATIONAL FLUID DYNAMICS;

COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; COOLING; FLOW FIELDS; FORCED CONVECTION; HEAT SINKS; NUSSELT NUMBER; REYNOLDS NUMBER; TEMPERATURE DISTRIBUTION;

EID: 43449084340     PISSN: 07351933     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.icheatmasstransfer.2008.02.012     Document Type: Article

References (12)

1. Azar K., McLeod R.S., and Caron R.E. Narrow channel heat sink for cooling of high powered electronic components. Proceedings of the 8th Annual IEEE Semi-therm Symposium (1992) 12-19
2. Morega A.M., Bejan A., and Lee A.W. Free stream cooling of a stack of parallel plate. Int. J. Heat Mass Transfer 38 3 (1995) 519-531
3. Ledezma G., and Bejan A. Heat sinks with sloped fins in natural and forced convection. Int. J. Heat Mass Transfer 39 9 (1995) 1773-1783
4. Lee S. Optimum design and selection of heat sinks. Proceedings of 11th IEEE Semi-thermal Symposium (1995) 48-54
5. Patel C.D., and Belady C.L. Modeling and metrology in high performance heat sink design. Proceedings of the 47th Electronic Components and Technology Conference, San Jose, California (1997), IEEE 296
6. Barret A.V., and Obienlo I.F. Characterization of longitudinal fin heat sink thermal performance and flow bypass effects through CFD methods. Proceeding of the13th Annual IEEE Semi-therm Symposium (1997) 158-164
7. Leon O., De May G., and Dick E. Study of optimal layout of cooling fins in forced convection cooling. Microelectron. Reliab. 42 (2002) 1101-1111
8. Copeland D.W. Fundamental performance limits of heat sink. ASME J. Electron. Packag. 125 (2003) 221-225
9. Lin S.C., Chuang F.S., and Chou C.A. Experimental study of the heat sink assembly with oblique straight fins. Exp. Therm. Fluid Sci. 29 (2005) 591-600
10. Yu X., Feng J., Feng Q., and Weng Q. Development of a plate-pin fin heat sink and its performance comparisons with a plate fin heat sink. Appl. Therm. Eng. 25 (2005) 173-182
11. Devdatta P.K., and Debendra K.D. Analytical and numerical studies on microscale heat sinks for electronic applications. Appl. Therm. Eng. 25 (2005) 2432-2449
12. Bar-Cohen A., Bahadur R., and Iyengar M. Least-energy optimization of air-cooled heat sinks for sustainability-theory, geometry and material selection. Energy 31 (2006) 579-619