Characterization of longitudinal fin heat sink thermal performance and flow bypass effects through CFD methods

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 1997, Pages 158-164

  Barrett, Adam V ^a   Obinelo, Izundu F ^a  

^a Thermalloy Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COOLING; FLOW OF FLUIDS; HEAT RESISTANCE; HEAT TRANSFER; MICROELECTRONIC PROCESSING; PRESSURE DROP; THERMODYNAMIC PROPERTIES;

FLOW BYPASS EFFECTS; FLOW RATES; FORCED AIR COOLING; LONGITUDINAL FIN HEAT SINKS; SPANWISE SPACING; TIP CLEARANCE;

HEAT SINKS;

EID: 0030734421     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (19)