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Volumn 25, Issue 14-15, 2005, Pages 2432-2449

Analytical and numerical studies on microscale heat sinks for electronic applications

Author keywords

CFD; Knudsen number; Mean free path; Microscale heat sink

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; CONTINUUM MECHANICS; ELECTRONIC EQUIPMENT; HEAT TRANSFER; MICROPROCESSOR CHIPS; REYNOLDS NUMBER; THERMAL CONDUCTIVITY;

EID: 19944401225     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2004.12.010     Document Type: Article
Times cited : (38)

References (16)
  • 1
    • 19944386042 scopus 로고    scopus 로고
    • Development of thermal analysis models for designing heat sinks for microelectronic devices
    • Phoenix Publishing House New Delhi, India
    • D.P. Kulkarni, and D.K. Das Development of thermal analysis models for designing heat sinks for microelectronic devices Emerging trends in mechatronics for automation 2002 Phoenix Publishing House New Delhi, India pp. 318-328
    • (2002) Emerging Trends in Mechatronics for Automation
    • Kulkarni, D.P.1    Das, D.K.2
  • 3
    • 19944408029 scopus 로고    scopus 로고
    • Alien Technology Inc., Seminar Presentation, Fairbanks, AK, August
    • M. Hadley, Nanoblocks™IC & Fluidic Self Assembly, Alien Technology Inc., Seminar Presentation, Fairbanks, AK, August 2001.
    • (2001) Nanoblocks™IC & Fluidic Self Assembly
    • Hadley, M.1
  • 8
    • 0343044605 scopus 로고
    • How to select a heat sink
    • S. Lee How to select a heat sink Electronics Cooling 1 1 1995 10 14
    • (1995) Electronics Cooling , vol.1 , Issue.1 , pp. 10-14
    • Lee, S.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.