Feedforward of mask open measurements on an integrated scatterometer to improve gate linewidth control

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5375, Issue PART 1, 2004, Pages 686-702

  Sendelbach, Matthew ^a   Natzle, Wesley ^a   Archie, Chas ^a   Banke, Bill ^a   Prager, Dan ^b   Engelhard, Dan ^b   Ferns, Jason ^b   Yamashita, Asao ^c   Funk, Merritt ^d   Higuchi, Fumihiko ^c   Tomoyasu, Masayuki ^e  

^a IBM MICROELECTRONICS   (United States)

^b Timbre Technologies Inc   (United States)

^c Tokyo Electron Massachusetts Inc   (United States)

^d TOKYO ELECTRON AMERICA INC   (United States)

^e TOKYO ELECTRON LTD   (Japan)

Author keywords

CD SEM; Chemical Oxide Removal; COR; Feedforward; Gate control; Iintegrated scatterometry; ODP; Scatterometry; TMU; Total Measurement Uncertainty

Indexed keywords

CD-SEM; CHEMICAL OXIDE REMOVAL; COR; FEEDFORWARD; GATE CONTROL; INTEGRATED SCATTEROMETRY; OPTICAL DIGITAL PROFILOMETRY (ODP); SCATTEROMETRY; TMU; TOTAL MEASUREMENT UNCERTAINTY;

ETCHING; GATES (TRANSISTOR); MEASUREMENT THEORY; OPTICAL SYSTEMS; OPTIMIZATION; PROFILOMETRY; SCANNING ELECTRON MICROSCOPY;

MASKS;

EID: 4344698016     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.537969     Document Type: Conference Paper

References (9)

1. http://public.itrs.net/Files/2003ITRS/Home2003.htm
2. M. Passow, G. Behm, W. Natzle, M. Sendelbach, T. Magtoto, D. Horak, A. Sekiguchi, M. Funk, M. Tomoyasu, K. Lally, T. Ishii, and D. Wasinger, "IBM 300 mm Fab: Integration Overview of Factory-level MES / APC Systems with a Process Tool Containing Integrated Metrology and Embedded APC Wafer-to-Wafer Control," Proceedings of AEC/APC Symposium XV, Colorado Springs, Colorado, USA, Sept 13-18, 2003.
3. M. Sendelbach and C. Archie, "Scatterometry measurement precision and accuracy below 70 nm," Metrology, Inspection, and Process Control for Microlithography XVII, Daniel J. Herr, Editor, Proceedings of SPIE, Vol. 5038, pp. 224-238, 2003.
4. B. Banke and C. Archie, "Characteristics of accuracy for CD metrology," Metrology, Inspection, and Process Control for Microlithography XIII, B. Singh, Editor, Proceedings of SPIE, Vol. 3677, pp. 291-308, 1999.
5. J. Mandel, The Statistical Analysis of Experimental Data, Interscience Publishers, John Wiley & Sons, New York, 1964.
6. J. Mandel, "Fitting Straight Lines When Both Variables are Subject to Error," Journal of Quality Technology, Vol. 16, No. 1, pp. 1-14, January 1984.
7. "U.S. Guide to the Expression of Uncertainty in Measurement", American National Standard for Calibration, ANSI/NCSL Z540-2-1997.
8. B. Taylor and C. Kuyatt, "Guidelines for Evaluating and Expressing the Uncertainty of NIST Measurements", NIST Tech. Note 1297, 1994.
9. M. Sendelbach, C. Archie, B. Banke, J. Mayer, H. Nii, P. Herrera, and M. Hankinson, "Correlating scatterometry to CD-SEM and electrical gate measurements at the 90 nm node using TMU analysis," Metrology, Inspection, and Process Control for Microlithography XVIII, Proceedings of SPIE, Vol. 5375, 2004.