The mechanical properties of ultra-low-dielectric-constant films

Thin Solid Films

Volumn 462-463, Issue SPEC. ISS., 2004, Pages 227-230

  Wang, Y H ^a   Moitreyee, M R ^a   Kumar, R ^a   Wu, S Y ^a   Xie, J L ^a   Yew, P ^a   Subramanian, B ^a   Shen, L ^b   Zeng, K Y ^b  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b INSTITUTE OF MATERIALS RESEARCH AND ENGINEERING   (Singapore)

Author keywords

Adhesion; Mechanical properties; Porous ultra low k; Thin film

Indexed keywords

INTERFACIAL ADHESIONS; POROUS ULTRA-LOW K; STRESS HYSTERESIS MEASUREMENTS;

ADHESION; CHEMICAL MECHANICAL POLISHING; CHEMICAL VAPOR DEPOSITION; ELASTIC MODULI; HYSTERESIS; MECHANICAL PROPERTIES; OPTICAL MICROSCOPY; PERMITTIVITY; SCANNING ELECTRON MICROSCOPY; STRENGTH OF MATERIALS; STRESS ANALYSIS;

THIN FILMS;

EID: 4344664672     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.05.038     Document Type: Article

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