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Volumn 43, Issue 6 A, 2004, Pages 3340-3345

Effect of phase formation behavior on thermal stability of hafnium-based thin films for copper interconnects

Author keywords

Copper; Hafnium; Nitrides; Sputtering

Indexed keywords

ANNEALING; ATOMIC FORCE MICROSCOPY; COPPER; HAFNIUM COMPOUNDS; MAGNETRON SPUTTERING; SILICON WAFERS; THERMODYNAMIC STABILITY;

COLUMNAR BARRIER; DIFFUSION BARRIERS; ION POLISHING SYSTEM (PIPS); NITROGEN FLOW RATIO;

THIN FILMS;

EID: 4344639494 PISSN: 00214922 EISSN: None Source Type: Journal
DOI: 10.1143/JJAP.43.3340 Document Type: Article

Times cited : (10)

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