Effect of microstructure on the thermal conductivity of hot-pressed silicon nitride materials

Journal of the American Ceramic Society

Volumn 85, Issue 1, 2002, Pages 200-206

  De Pablos, Angel ^a   Osendi, María Isabel ^a   Miranzo, Pilar ^a  

^a INSTITUTO DE CERÁMICA Y VIDRIO   (Spain)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MATERIALS; GRAIN SIZE AND SHAPE; HOT PRESSING; MATHEMATICAL MODELS; MICROSTRUCTURE; SILICON NITRIDE; TEXTURES; THERMAL CONDUCTIVITY; THERMAL EFFECTS;

MICROSTRUCTURAL PARAMETERS;

CERAMIC MATERIALS;

EID: 0036343774     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1151-2916.2002.tb00066.x     Document Type: Conference Paper

References (24)

1. 4
2. Review, reaction-bonded silicon nitride: Its formation and properties
3. 4 by the laser flash method
4. Thermal properties and thermal shock resistance of silicon nitride
5. Thermal properties of HIP sintered silicon nitride
6. Thermal conductivity of gas-pressure sintered silicon nitride
7. 4 with and without Additives
8. Effect of sintering additive composition on the thermal conductivity of silicon nitride
9. Effect of seeding on the thermal conductivity of self reinforced silicon nitride
10. High thermal conductivity in silicon nitride with anisotropic microstructure
11. 4: I, effects of various microstructural factors
12. 4
13. 4: II, effects of lattice oxygen
14. Thermal conductivity of α-SIALON ceramics
15. 4 by x-ray diffraction analysis
16. Improved data reduction methods for laser pulse diffusivity determination with the use of minicomputers
17. 3
18. Low thermal conductivity in garnets
19. Percolation and conduction
20. Computer simulation of percolation structure in composites
21. Effective thermal conductivity of composites with interfacial thermal barrier resistance