Studies on a reflowable underfill for flip chip application

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 323-329

  Wang, Tie ^a   Lum, Colin ^a   Kee, Joanne ^a   Chew, T H ^a   Miao, Ping ^a   Foo, Louis ^a   Lin, Charles ^a  

^a Questech Solutions Pte Ltd   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; CURING; DIFFERENTIAL SCANNING CALORIMETRY; FAILURE ANALYSIS; GLASS TRANSITION; TEMPERATURE; THERMAL CYCLING; VISCOSITY;

DYNAMIC MECHANICAL ANALYZER; HIGH TEMPERATURE STORAGE TEST; SCANNING ACOUSTIC MICROSCOPY; THERMOMECHANICAL ANALYZER;

FLIP CHIP DEVICES;

EID: 0034476470     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)