Plasma-enhanced ALD of titanium-silicon-nitride using TiCl4, SiH4, and N2/H2/Ar plasma

Electrochemical and Solid-State Letters

Volumn 7, Issue 8, 2004, Pages

  Park, Jin Seong ^a   Rang, Sang Won ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; DIFFUSION; ELECTROMIGRATION; ELECTRON SPECTROSCOPY; PHYSICAL VAPOR DEPOSITION; PLASMAS; POLYCRYSTALLINE MATERIALS; SILICON NITRIDE; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

ARGON GAS MIXTURES; ATOMIC LAYER DEPOSITION (ALD); SELF-LIMITING FILM GROWTH;

TITANIUM COMPOUNDS;

EID: 4344613590     PISSN: 10990062     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1764413     Document Type: Article

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