Wire-sawing defects on multicrystalline silicon wafers grown by a directional solidification method

Semiconductor Science and Technology

Volumn 23, Issue 5, 2008, Pages

  Du, Guoping ^a,b   Chen, Nan ^a   Rossetto, Pietro ^c  

^a NANCHANG UNIVERSITY   (China)

^b SHANGHAI NORMAL UNIVERSITY   (China)

^c LDK Solar Hi Tech Co Ltd   (China)

Author keywords

[No Author keywords available]

Indexed keywords

DEFECTS; MATHEMATICAL MODELS; SAWING; SOLAR CELLS; SOLIDIFICATION;

MULTICRYSTALLINE MATERIALS; SAWING RIDGES; WIRE SAWING DEFECTS;

SILICON WAFERS;

EID: 43149106692     PISSN: 02681242     EISSN: 13616641     Source Type: Journal    
DOI: 10.1088/0268-1242/23/5/055011     Document Type: Article

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