Hard inclusions and their detrimental effects on the wire sawing process of multicrystalline silicon

Solar Energy Materials and Solar Cells

Volumn 91, Issue 18, 2007, Pages 1743-1748

  Du, Guoping ^a,c   Zhou, Lang ^a,c   Rossetto, Pietro ^b,c   Wan, Yuepeng ^b,c  

^a NANCHANG UNIVERSITY   (China)

^b LDK Solar Hi Tech Co Ltd   (China)

^c NCU LDK Research Center for Solar Energy   (China)

Author keywords

Multicrystalline silicon; Si3N4 particles; SiC particles; Wire sawing

Indexed keywords

CRYSTALLINE MATERIALS; MATHEMATICAL MODELS; SILICON WAFERS; STRESS CONCENTRATION;

MULTICRYSTALLINE SILICON; SAWING RIDGES; SIC PARTICLES; WIRE SAWING;

SILICON COMPOUNDS;

EID: 34548219124     PISSN: 09270248     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.solmat.2007.06.001     Document Type: Article

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