Low temperature bonding of alumina/alumina and alumina/copper in air using Sn3.5Ag4Ti(Ce,Ga) filler

Journal of Electronic Materials

Volumn 36, Issue 9, 2007, Pages 1193-1198

  Chang, S Y ^a   Chuang, T H ^b   Yang, C L ^a  

^a NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Active soldering; Alumina; Copper; Sn3.5Ag4Ti(Ce,Ga)

Indexed keywords

ACTIVE FILLERS; AGING PERIODS; BONDING SURFACES; LOW TEMPERATURE BONDING;

ALUMINA; BOND STRENGTH (MATERIALS); LOW TEMPERATURE EFFECTS; METALLIZING; PROTECTIVE ATMOSPHERES; TIN ALLOYS;

FILLERS;

EID: 34548252463     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-007-0190-9     Document Type: Article

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