Active soldering of ITO to copper

Welding Journal (Miami, Fla)

Volumn 85, Issue 4, 2006, Pages

  Chang, S Y ^a   Lu, M H ^b   Tsao, L C ^c   Chuang, T H ^c  

^a NATIONAL YUNLIN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b METAL INDUSTRIES RESEARCH AND DEVELOPMENT CENTRE   (Taiwan)

^c NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Active Soldering; Copper Backing Plate; ITO Target; Sn56Bi4Ti(Ce, Ga) Filler

Indexed keywords

CERAMIC MATERIALS; COPPER; FILLER METALS; INDIUM COMPOUNDS; TITANIUM;

ACTIVE SOLDERING; COPPER BACKING PLATES; ITO TARGET; SN56BI4TI(CE, GA) FILLERS;

SOLDERING;

EID: 33645672190     PISSN: 00432296     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (8)

1. Granqvist, C. G., and Hultåker, A. 2002.Transparent and conduction ITO film: new developments and applications. Thin Solid Films 411: 1-5.
2. Howson, R. P., Safi, I., Hall, G. W., and Danson, N. 1997. Sputtering of indium-tin oxide. Nucl. Instr. and Meth. B 121: 96-101.
3. Elssner, G., and Petzow, G. 1990. Metal/ceramic joining. ISIJ 30: 1011-1032.
4. Weise, W., Malikowski, W., and Bohm, W. Bonding Ceramic to Ceramic with Metal through Active Solders under Argon or Vacuum. Firmenschrift Degussa Hanau AG, Hanau, Germany (in German).
5. Chang, S. Y., Hung, Y. T., and Chuang, T. H. 2003. Joining alumina to Inconel® 600 and UMCo-50 superalloys using an Sn10Ag4Ti active filler metal. JMEPEG 12: 123-127.
6. 3 and SiC substrates. Ceram. Int. 24: 273-279.
7. Hillen, F., Pickart-Castillo, D., Rass, I. J., and Lugscheider, E. 2000. Solder alloys and soldering processes for flux-free soldering of difficult-to-wet materials. Welding & Cutting 52 (8): E162-E165.
8. Smith, R. W. 2001. Active solder joiningof metals, ceramics, and composites. Welding Journal 80(10): 30-35.