Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler

Journal of Materials Engineering and Performance

Volumn 12, Issue 4, 2003, Pages 383-389

  Chang, S Y ^a   Tsao, L C ^a   Chiang, M J ^a   Tung, C N ^b   Pan, G H ^b   Chuang, T H ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b METAL INDUSTRIES RESEARCH AND DEVELOPMENT CENTRE   (Taiwan)

Author keywords

Active filler; Active soldering; Air; Copper; Interface; ITO; Sn3.5Ag4Ti(Ce, Ga)

Indexed keywords

AIR; COPPER; FILLERS; INTERFACES (MATERIALS); SOLDERING;

ACTIVE SOLDERING;

INDIUM COMPOUNDS;

EID: 0041817958     PISSN: 10599495     EISSN: None     Source Type: Journal    
DOI: 10.1361/105994903770342890     Document Type: Article

References (8)

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