Measurement of driving electrical signal and input impedance analysis of PZT transducer in thermosonic bonding

Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'04

Volumn , Issue , 2004, Pages 322-325

  Long, Zhili ^a   Wu, Yunxin ^a   Han, Lei ^a   Li, Jianping ^a   Zhou, Hongquan ^a  

^a CENTRAL SOUTH UNIVERSITY   (China)

Author keywords

Driving electrical signal of PZT transducer; Impedance analysis; Thermosonic bonding

Indexed keywords

DIGITAL STORAGE; ELECTRIC LOSSES; ELECTRIC POTENTIAL; ELECTRIC SIGNAL SYSTEMS; PIEZOELECTRIC TRANSDUCERS; ULTRASONICS;

DIELECTRIC ELECTRICAL SIGNAL OF PZT TRANSDUCERS; IMPEDANCE ANALYSIS; THERMOSONIC BONDING; ULTRASONIC ENERGY;

ELECTRONICS PACKAGING;

EID: 14844316689     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. C.F.Luk, Y.C.Chan, K.C.Hung. Development of gold to gold interconnection flip chip bonding for chip on suspension assemblies. Microeletronics Reliability[J]. 2002 (12):381-389
2. S.F.Kang,P.M.Williams,T.S.McLaren,Y.C.Lee.Studies of thermosonic bonding for flip-chip assembly. Materials Chemistry and Physics[J], v42, 1995:31-37