Studies of thermosonic bonding for flip-chip assembly

Materials Chemistry & Physics

Volumn 42, Issue 1, 1995, Pages 31-37

  Kang, S Y ^a   Williams, P M ^a   McLaren, T S ^a   Lee, Y C ^a  

^a UNIVERSITY OF COLORADO   (United States)

Author keywords

Flip chip assembly; Thermosonic bonding

Indexed keywords

ACOUSTICS; ASSEMBLY; BOND STRENGTH (MATERIALS); BONDING; FLIP CHIP DEVICES; INTEGRATED OPTOELECTRONICS; MATHEMATICAL MODELS; MULTICHIP MODULES; SEMICONDUCTING GALLIUM ARSENIDE; SOLDERING; ULTRASONIC PROPAGATION;

ACOUSTIC SOFTENING EFFECT; FLIP CHIP ASSEMBLY; GAAS-ON-SILICON TEST VEHICLES; SOLDERLESS TECHNOLOGY; THERMOCOMPRESSION BONDING; THERMOSONIC BONDING;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0029387736     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/0254-0584(95)80039-5     Document Type: Article

References (18)

1. LED array modules by new technology microbump bonding method
2. A fine pitch COG technique for a TFT-LCD panel using an indium alloy
3. Effects of Ultrasound on Deformation Characteristics of Metals
4. EFFECT OF SONIC AND ULTRASONIC RADIATION ON SAFETY FACTORS OF ROCKETS AND MISSILES