Experiment and simulation of hot embossing of a bulk metallic glass with low pressure and temperature

Journal of Micromechanics and Microengineering

Volumn 18, Issue 2, 2008, Pages

  Pan, C T ^a   Wu, T T ^a   Chang, Y C ^a   Huang, J C ^a  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SOFTWARE; DIFFERENTIAL SCANNING CALORIMETRY; MEMS; PHOTORESISTS; THERMODYNAMIC PROPERTIES; THERMOFORMING;

HOT EMBOSSING; SECONDARY MOLDS;

METALLIC GLASS;

EID: 42549127214     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/18/2/025010     Document Type: Article

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