Cavity-through deep reactive ion etching of directly-bonded silicon wafers

TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems

Volumn , Issue , 2007, Pages 549-553

  Kang, Piljoong ^a   Tanaka, Shuji ^a   Esashi, Masayoshi ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

Deep reactive ion etching (DRIE); Direct bonding; Multilayer MEMS; Plasma treatment

Indexed keywords

ACTUATORS; ELECTRON BEAM LITHOGRAPHY; ETCHING; MICROSYSTEMS; NONMETALS; PULSED LASER DEPOSITION; REACTIVE ION ETCHING; SENSORS; SILICON; TRANSDUCERS; WAFER BONDING;

BOSCH PROCESSES; DEEP REACTIVE ION ETCHING; DEEP REACTIVE ION ETCHING (DRIE); DIRECT BONDING; INTERNATIONAL CONFERENCES; MULTILAYER MEMS; PLASMA TREATMENT; SILICON-DIRECT-BONDING; SOLID-STATE SENSORS; SYSTEMATIC STUDY;

SILICON WAFERS;

EID: 42549125168     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SENSOR.2007.4300189     Document Type: Conference Paper

References (8)

1. Yuichi Miura et al., Inherent Orifice Radial Bearing and Hydroinertia Axial Bearing For MEMS-based Turbo Machinery, PowerMEMS 2005, Tokyo, November 28-30, 2005, pp. 41-44.
2. Takashi Genda et al., High Power Electrostatic Motor with Micropatterned Electret on Shrouded Turbine, Transducers '05, Seoul, Korea, June 5-9, 2005, pp. 709-712.
3. Gudrun Kissinger, Wolfgang Kissinger, Void-free silicon-wafer-bond strengthening in the 200-400 °C range, Sensors & Actuators A, 36 (1993) pp. 149-156.
4. O. Zucker et al., Application of oxygen plasma processing to silicon direct bonding, Sensors & Actuators A, 36 (1993) pp. 227-231.
5. Shari N. Farrens et al., Chemical Free Room Temperature Wafer To Wafer Direct Bonding, J. Electrochem. Soc., 142 (1995) pp. 3949-3955.
6. 2-Plasma-Treated Silicon (100) Surfaces, J. Electrochem. Soc., 147 (2000) pp. 2734-2740.
7. Xuan Xiong Zhang, Jean-Pierre Raskin, Low-Temperature Wafer Bonding: A Study of Void Formation and Influence on Bonding Strength, J. Microelectromech. Syst., 14 (2005) pp. 368-382.
8. N. Miki et al., Multi-stack silicon-direct wafer bonding for 3D MEMS manufacturing, Sensors & Actuators A, 103 (2003) pp. 194-201.