Flip-chip interconnection using anisotropic conductive adhesive with lead free nano-solder particles

ESTC 2006 - 1st Electronics Systemintegration Technology Conference

Volumn 1, Issue , 2006, Pages 282-286

  Verma, Suresh Chand ^a   Guan, Wanbing ^b   Andersson, Cristina ^a   Gao, Yulai ^b   Zhai, Qijie ^b   Liu, Johan ^a,b  

^a CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

^b SHANGHAI UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; CONDUCTIVE MATERIALS; CONTACT RESISTANCE; EPOXY RESINS; INTERCONNECTION NETWORKS; OPTICAL ANISOTROPY;

ANISOTROPIC CONDUCTIVE ADHESIVES (ACA); FLIP CHIP PACKAGES; FLIP-CHIP INTERCONNECTIONS; SILICON CHIPS;

FLIP FLOP CIRCUITS;

EID: 42549115219     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2006.280011     Document Type: Conference Paper

References (10)

1. th IEEE Electronics Packaging Technology Conference, EPTC 2004, pp.455-461.
2. th IEEE conference on Nanotechnology, Nagoya, Japan, 2005.
3. A.O. Aggarwal, P.M. Raj, I.R. Abothu, M.D. Sacks, A.A.O. Tay, and Rao R. Tummala, "New Paradigm in IC-Package Interconnections by Reworkable Nano-Interconnects" IEEE electronic component and technology conference, ECTC-2004, proceedings, vol.1,pp. 451-460.
4. G.Y. Li and C.P. Wong, " Nano-Ag filled anisotropic conductive adhesives (ACA) with self-assembled monolayer and sintering behaviour for high performance fine pitch Interconnect", IEEE electronic component and technology conference, ECTC'2005, proceedings, pp. 1147-1154.
5. Johan Liu, Cristina Andersson and Suresh Chand Verma. Lead free nanosolder paste for electronics packaging and interconnect applications, Swedish patent pending, March, 2006.
6. Qijie Zhai, Yu Lai Gao, Wanbing Guan, Johan Liu and Kuangdi Xu, Chinese patent pending, April 2006.
7. Johan Liu, Anisotropic Conductive Adhesive Containing Nano Lead-Free Particles, Swedish patent pending, June 2006.
8. W.B.Guan, S. C.Verma, Y.L. Gao, Q.J. Zhai, and J.Liu, " Characterization of nano-sized powders of Sn-Bi eutectic alloy produced by spark erosion", submitted to Journal of Scripta Materials, May 2006.
9. Johan Liu, Qijie Zhai, Suresh Chand Verma and Wanbing Guan, Characterization of Nanoparticles of Lead Free Solder Alloys, this proceedings.
10. J.Baliga, "Nanotechnology comes the lead free rescue" Semiconductor International, May-2005,28,5,ABI/INFORM Global, pp. 32.