Forming low resistance nano-scale contacts using solder reflow

2005 5th IEEE Conference on Nanotechnology

Volumn 2, Issue , 2005, Pages 561-564

  Ye, Hongke ^a   Gu, Zhiyong ^a   Yu, Thomas ^a   Bernfeld, Adam ^a   Leong, Timothy ^a   Gracias, David H ^a,b  

^a Johns Hopkins University   (United States)

^b JOHNS HOPKINS UNIVERSITY   (United States)

Author keywords

Molecular electronics; Nanotechnology; Self assembly; Semiconductor devices; Solder; VLSI

Indexed keywords

ELECTRIC CONDUCTIVITY; ELECTRIC RESISTANCE; ELECTRODEPOSITION; NANOSTRUCTURED MATERIALS; NANOTECHNOLOGY; SELF ASSEMBLY; SEMICONDUCTOR DEVICES; THIN FILMS; VLSI CIRCUITS;

MICROFABRICATED BOND PADS; MOLECULAR ELECTRONICS; NANOWIRES; SOLDER;

SOLDERING;

EID: 33746906301     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/NANO.2005.1500826     Document Type: Conference Paper

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