Determination of deformation fields and visualization of buried structures by atomic force acoustic microscopy

ESTC 2006 - 1st Electronics Systemintegration Technology Conference

Volumn 2, Issue , 2006, Pages 1330-1335

  Köhler, Bernd ^a   Bendjus, Beatrice ^a   Striegler, André ^a  

^a FRAUNHOFER INSTITUTE FOR NON DESTRUCTIVE TESTING   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

INFORMATION ANALYSIS; SCANNING PROBE MICROSCOPY; TOPOGRAPHY; ULTRASONIC EQUIPMENT;

ACOUSTIC IMAGES; ULTRASONIC FORCE MICROSCOPY;

ELECTRONIC EQUIPMENT;

EID: 42549089163     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2006.280183     Document Type: Conference Paper

References (6)

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2. U. Rabe and W. Arnold, "Acoustic microscopy by atomic force microscopy", Appl Phys. Lett. Vol. 64, (1994), pp. 1493.
3. G.S. Shekhawat, O.V. Kolosov, G.A.D. Briggs, E.O. Schaffer, S.J.M. Martin, R.E. Geer, "Nanoscale Elastic Imaging: A New Metrology Tool for Low-k Dielectric Integration", Proc. International Interconnect Technology Conference (IITC), 2000, pp. 96-98.
4. D. Vogel, B. Michel, "The microDAC method - a powerful means for microdeformation analysis in electronic packaging", Mechanical Engineering Congress and Exposition, Proc. AMD, Vol. 226, EEP-VoL 22, 1997.
5. D. Vogel, V. Grosser, A. Schubert, B. Michel, "MicroDAC Strain Measurement for Electronics Packaging", Structures, Optics and Lasers in Engineering, Vol. 36, (2001), pp. 195-211.
6. B. Michel, D. Vogel, "Nondestructive Evaluation and Reliability of Micro- and Nanomaterial Systems", SPIE Proceedings Series 4703, ISBN 0-8194-4451-0, (2002), pp. 194-198.