The microdac method - A powerful means for microdeformation analysis in electronic packaging

American Society of Mechanical Engineers, Applied Mechanics Division, AMD

Volumn 226, Issue , 1997, Pages 117-123

  Michel, Bernd ^a   Vogel, Dietmar ^a   Schubert, Andreas ^a   Auersperg, Jürgen ^a   Reichl, Herbert ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 3743101776     PISSN: 01608835     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (13)

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2. Caers, J. F. J. M., 1996, MCM reliability with emphasis on flip chip, 7th European Symp. on Reliability of Electron Devices, Failure Physics and Analysis, Enschede, Tutorial Notes.
3. Coffin L.F., 1962, Low cycle fatigue: a review, Appl. Mech. Res., Vol. 1(3), October, pp. 129-141.
4. Dudek, R., Michel, B., 1994, Thermomechanical reliability assessment in SM- and COB-technology by combined experimental and Finite Element method, Proc. Int. Reliability Physics Symp., San Jose, IEEE Catalog No. 94CH3332-4, pp. 458-465.
5. Hacke, P. L., Sprecher, A., L., Conrad, H., 1993. Thermomechanical fatigue of 63Sn-37Pb solder joints, in "Thermal Stress and Strain in Microelectronics Packaging", ed. by J.H. Lau, Van Nostrand Reinhold, N.Y.
6. Han, B., Gou, Y., 1995, Thermal deformation analysis of various electronic packaging products by Moiré interferometry, J. of Electronic Packaging, Vol. 117, September, pp.185-191.
7. Lau, J. H., 1996, Flip Chip Technologies, McGraw-Hill, N. Y.
8. Pecht, M., Dasgupta, A., Evans, J. W., Evans, J. Y., 1994, Flip Chip Bonds, in "Quality conformance and qualification of microelectronic packages and interconnects", J. Whiley & Sons, N.Y., pp. 207-236.
9. Post, D., Han, B., Ifju, P., 1994, Thermal deformations in electronic packaging in "High Sensitivity Moire", Springer-Verlag, N.Y., 331-347.
10. Simon, J., Auersperg, J., Schubert, A., Michel,B., Reichl,H., 1996, A computational comparison of different CSP approaches, 3 rd VLSI Packaging Workshop of Japan, Kyoto, pp. 80-83.
11. Uhlig, C., Kahle, O., Vogel, D., Bauer, M., 1997, The application of thermophysical methods in microsystems and microelectronics, to be published in Proc. of Micro Materials '97, Berlin.
12. Vogel, D., Auersperg, J., Schubert, A., Michel, B., Reichl, H., 1997a, Deformation analysis on flip chip solder interconnects by microDAC, Proc. of Reliability of Solders and Solder Joints Symposium at 126th TMS Annual Meeting & Exhibition, Orlando, USA, in "Design & Reliability of Solders and Solder Interconnects", ed. by R.K. Mahidhara, TMS Publication Cat. No. 96-80433, pp. 429-438.
13. Vogel, D., Caers, J., Auersperg, J., Schubert, A., Michel, B., 1997, Advanced deformation and failure analysis on flip chip assemblies, to be published in Proc. of Micro Materials '97, Berlin.