Enhancement of oxidation resistance and electrical properties of indium-doped copper thin films

Journal of Electronic Materials

Volumn 37, Issue 6, 2008, Pages 852-859

  Hsu, C S ^a   Hsieh, H Y ^a   Fang, J S ^a  

^a NATIONAL FORMOSA UNIVERSITY   (Taiwan)

Author keywords

Copper interconnection; Dilute Cu thin film INTRODUC; Oxidation resistance; Self forming; Self passivation; Thin film transistor

Indexed keywords

COPPER INTERCONNECTION; ELECTRONIC DEVICES; OXYGEN ATMOSPHERES;

COPPER; DOPING (ADDITIVES); GLASS; GRAIN GROWTH; INDIUM; METALLIZING; OXIDATION RESISTANCE; PASSIVATION; THIN FILM TRANSISTORS; X RAY DIFFRACTION;

THIN FILMS;

EID: 42449120996     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0394-7     Document Type: Article

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