Optical interconnection using fiber-embedded boards and connection blocks fabricated by a micro-grooving technique for fiber insertion

Journal of Micromechanics and Microengineering

Volumn 14, Issue 8, 2004, Pages 1181-1184

  Cho, Han Seo ^a   Kang, Saekyoung ^a   Cho, Mu Hee ^a   Rho, Byung Sup ^a,d   Park, Hyo Hoon ^a   Shin, Kyoung Up ^b   Ha, Sang Won ^b   Rhee, Byoung Ho ^b   Kim, Dong Su ^c   Jung, Tea Sun ^c   Kim, Taeil ^c  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Samsung Electro Mechanics   (South Korea)

^c SAMSUNG Electronics   (South Korea)

^d Korea Photonics Technology Institute (KOPTI)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ENERGY DISSIPATION; GLASS FIBERS; MICROLENSES; POLYIMIDES; PRINTED CIRCUIT BOARDS; SIGNAL PROCESSING; SILICON WAFERS; SURFACE MOUNT TECHNOLOGY; WAVEGUIDES;

CONNECTION BLOCKS; LIGHT SIGNALS; MECHANICAL POLISHING; SURFACE-MOUNTED TRANSMITTERS;

OPTICAL INTERCONNECTS;

EID: 4243050493     PISSN: 09601317     EISSN: None     Source Type: Journal    
DOI: 10.1088/0960-1317/14/8/009     Document Type: Article

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