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Optics and Lasers in Engineering
Volumn 42, Issue 5, 2004, Pages 503-509
A simple method for calculating coupling efficiency in optical interconnection system involving various misalignment parameters
Author keywords

Coupling efficiency; Misalignment; Optical interconnection
Indexed keywords

APPROXIMATION THEORY; DIFFRACTION GRATINGS; ELECTRIC LINES; MICROLENSES; OPTICAL FIBER COUPLING; PHOTODETECTORS; PRISMS; WAVEGUIDES;
EID: 3142563006     PISSN: 01438166     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.optlaseng.2004.02.002     Document Type: Article
Times cited : (4)
References (6)
  • 1
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    • Kosaka H. Smart integration and packaging of 2-D VCSEL's for high-speed parallel links. IEEE J. Selected Topics Quantum Electron. 5:1999;184-192.
    • (1999) IEEE J. Selected Topics Quantum Electron , vol.5 , pp. 184-192
    • Kosaka, H.1
  • 2
    • 0029720978 scopus 로고    scopus 로고
    • Alignment tolerance measurements and optical coupling modeling for optoelectronic array interface assemblies
    • Orlando: Packaging and Manufacturing Technology Society
    • Sutherland J., George G., Van der Groen S., Krusius J.P. Alignment tolerance measurements and optical coupling modeling for optoelectronic array interface assemblies. Proceedings of IEEE Electronic Components and Technology, IEEE Components. 1996;480-486 Packaging and Manufacturing Technology Society, Orlando.
    • (1996) Proceedings of IEEE Electronic Components and Technology, IEEE Components , pp. 480-486
    • Sutherland, J.1    George, G.2    Van Der Groen, S.3    Krusius, J.P.4
  • 3
    • 0010265501 scopus 로고
    • Alignment and fabrication tolerances of planar gratings for board-to-board optical interconnects
    • Rastani K., Hubbard W.M. Alignment and fabrication tolerances of planar gratings for board-to-board optical interconnects. Appl Opt. 31:1992;4863-4870.
    • (1992) Appl Opt , vol.31 , pp. 4863-4870
    • Rastani, K.1    Hubbard, W.M.2
  • 4
    • 2342494110 scopus 로고    scopus 로고
    • Integration of optical devices on a transparent substrate for chip levels optical interconnection
    • 13-16 July, Melbourne, Australia
    • Cho H, Eo J-Y, Kang S, Han M-G, Chu K, Rho B, Park H-H. Integration of optical devices on a transparent substrate for chip levels optical interconnection. In: COIN ACOFT 2003, 13-16 July, Melbourne, Australia:2003. p. 403-6.
    • (2003) COIN ACOFT 2003 , pp. 403-406
    • Cho, H.1    Eo, J.-Y.2    Kang, S.3    Han, M.-G.4    Chu, K.5    Rho, B.6    Park, H.-H.7
  • 5
    • 0034833279 scopus 로고    scopus 로고
    • SMT-compatible optical-I/O chip packaging for chip-level optical interconnects
    • Orlando: Packaging and Manufacturing Technology Society
    • Ishii Y., Koike S., Arai Y., Ando Y. SMT-compatible optical-I/O chip packaging for chip-level optical interconnects. Proceedings of IEEE Electronic Components and Technology, IEEE Components. 2001;870-875 Packaging and Manufacturing Technology Society, Orlando.
    • (2001) Proceedings of IEEE Electronic Components and Technology, IEEE Components , pp. 870-875
    • Ishii, Y.1    Koike, S.2    Arai, Y.3    Ando, Y.4
  • 6
    • 3142578849 scopus 로고    scopus 로고
    • 2.5Gbit/s monolithic opto-electronic receiver for optical interconnects
    • Lang M. 2.5Gbit/s monolithic opto-electronic receiver for optical interconnects. Fraunhofer IAF Annual Report. 2000. p. 16-17.
    • (2000) Fraunhofer IAF Annual Report , pp. 16-17
    • Lang, M.1

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.