A novel characterization method for thermal thin-film properties applied to PECVD silicon nitride

Proceedings of IEEE Sensors

Volumn , Issue , 2007, Pages 938-941

  Beigelbeck, Roman ^a   Kohl, Franz ^a   Keplinger, Franz ^b   Kuntner, Jochen ^b   Jakoby, Bernhard ^c  

^a ERICH SCHMID INSTITUTE OF MATERIALS SCIENCE   (Austria)

^b VIENNA UNIVERSITY OF TECHNOLOGY   (Austria)

^c JOHANNES KEPLER UNIVERSITY LINZ   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

NITRIDES; NONMETALS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; SEMICONDUCTING FILMS; SILICON; SILICON NITRIDE; THIN FILM DEVICES;

CHARACTERIZATION METHODS; MICROMACHINED; PECVD SILICON NITRIDE; SENSOR DEVICES; THIN-FILM PROPERTIES;

SENSORS;

EID: 42149181214     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICSENS.2007.4388557     Document Type: Conference Paper

References (6)

1. R. Beigelbeck, J. Kuntner, F. Kohl, and B. Jakoby, "Sensing Thermal Material Properties of Fluids Utilizing the Frequency Respsonse of a Micromachined Sensor," in Proceedings of the Eurosensors XX Conference, vol. 2, Göteborg, Sweden, September 2006, pp. 242-245.
2. M. Von Arx, O. Paul, and H. Baltes, "Process dependent thin film thermal conductivities for thermal CMOS MEMS," Journal of MEMS, vol. 9, no. 1, pp. 136-145, 2000.
3. P. Eriksson, J. Andersson, and G. Stemme, "Thermal characterization of surface-micromachined silicon nitride membranes for thermal infrared detectors," Journal of MEMS, vol. 6, pp. 55-61, March 1997.
4. J. Kuntner, A. Jachimowicz, F. Kohl, and B. Jakoby, "Determining the thin-film thermal conductivity of low temperature PECVD silicon nitride," in Proceedings of the Eurosensors XX Conference, vol. 2, Göteborg, Sweden, September 2006, pp. 388-391.
5. H. S. Carslaw and J. C. Jaeger, Conduction of Heat in Solids, 2nd ed. Oxford University Press, 1990.
6. R. Beigelbeck, F. Kohl, J. Kuntner, F. Keplinger, and B. Jakoby, "A Novel Characterization Method of Process Dependent Thermal Thin-Films Properties," IEEE Sensors Journal, submitted for publ. in 2007.