Life cycle assessment of Japanese high-temperature conductive adhesives

Environmental Science and Technology

Volumn 42, Issue 8, 2008, Pages 3084-3089

  Andrae, Anders S G ^a   Itsubo, Norihiro ^b   Yamaguchi, Hiroshi ^a   Inaba, Atsushi ^a  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^b TOKYO CITY UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

PRINTED BOARD ASSEMBLIES; SOLDER PASTE;

ADHESIVES; PROBABILITY; SOLDERING ALLOYS; THERMAL EFFECTS;

LIFE CYCLE;

ADHESIVE AGENT; ALLOY; BISMUTH; ELECTRICALLY CONDUCTIVE ADHESIVE; SILVER; TIN; UNCLASSIFIED DRUG;

ADHESIVES; LIFE CYCLE; PROBABILITY; SOLDERING ALLOYS; THERMAL EFFECTS;

ADHESION; ELECTRICAL CONDUCTIVITY; ELECTRONICS INDUSTRY; EMISSION CONTROL; ENERGY USE; HIGH TEMPERATURE; LIFE CYCLE ANALYSIS; MODELING; TOXICITY;

ARTICLE; ATMOSPHERIC DISPERSION; ELECTRIC CONDUCTIVITY; ELECTRONICS; ENERGY CONSUMPTION; ENVIRONMENTAL IMPACT ASSESSMENT; HIGH TEMPERATURE; LIFE CYCLE ASSESSMENT; MATERIALS; MELTING POINT; PROBABILITY; RECYCLING; RELIABILITY; TOXICITY TESTING;

ADHESIVES; BISMUTH; ELECTRONICS; ENVIRONMENT; HEAT; HUMANS; JAPAN; RISK ASSESSMENT; SILVER; TIN;

EID: 42149144091     PISSN: 0013936X     EISSN: None     Source Type: Journal    
DOI: 10.1021/es0709829     Document Type: Article

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