Thermal expansion of particle-filled plastic encapsulant: A micromechanical characterization

Acta Materialia

Volumn 46, Issue 12, 1998, Pages 4287-4302

  Chaturvedi, M ^a   Shen, Y L ^a  

^a University of New Mexico   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOSITE MICROMECHANICS; ENCAPSULATION; EPOXY RESINS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; MICROELECTRONICS; PARTICLES (PARTICULATE MATTER); PLASTICS FILLERS; SILICA; STRESS ANALYSIS; THERMAL EXPANSION; VISCOELASTICITY;

THERMAL EXPANSION COEFFICIENT;

NONMETALLIC MATRIX COMPOSITES;

EID: 0032108637     PISSN: 13596454     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6454(98)00089-5     Document Type: Article

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