Thermal expansion and thermal mismatch stress relaxation behaviors of SiC whisker reinforced aluminum composite

Materials Chemistry and Physics

Volumn 77, Issue 3, 2003, Pages 882-888

  Fei, W D ^a   Hu, M ^a   Yao, C K ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Aluminum matrix composite; SiC whisker; Thermal expansion; Thermal mismatch stress

Indexed keywords

ALUMINUM; COMPOSITE MATERIALS; CRYSTAL WHISKERS; ELECTRON MICROSCOPES; MICROSTRUCTURE; STRESS RELAXATION; THERMAL EXPANSION; X RAY DIFFRACTION ANALYSIS;

THERMAL MISMATCH STRESS (TMS);

SILICON COMPOUNDS;

EID: 0037472263     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0254-0584(02)00172-4     Document Type: Article

References (20)