Dynamic simulation of isothermal solidification in steel/Cu/steel system rolling-diffusion bonding process

Hanjie Xuebao/Transactions of the China Welding Institution

Volumn 29, Issue 3, 2008, Pages 61-64

  Li, Hong ^a   Li, Zhuoxin ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Effective diffusion coefficient; Isothermal solidification; Kinetic simulation; Plastic deformation; Rolling diffusion bonding

Indexed keywords

BOND STRENGTH (MATERIALS); CARBON STEEL; COPPER; DIFFUSION; DIFFUSION BONDING; DYNAMICS; MATHEMATICAL MODELS; PLASTIC DEFORMATION; SOLIDIFICATION;

EFFECTIVE DIFFUSION COEFFICIENT; ISOTHERMAL SOLIDIFICATION; KINETIC SIMULATION; ROLLING DIFFUSION BONDING;

ROLL BONDING;

EID: 41949086645     PISSN: 0253360X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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