Pluggable optical board interconnection system with flexible polymeric waveguides

IEEE Photonics Technology Letters

Volumn 20, Issue 8, 2008, Pages 572-574

  Ahn, Seung Ho ^a   Cho, In Kui ^a   Rhee, Byoung Ho ^b   Lee, Man Seop ^c  

^a Electronics and Telecommunications Research Institute (ETRI)   (South Korea)

^b ISU Petasys Co Ltd   (South Korea)

^c Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Optical interconnect; Polymeric waveguide; Printed circuit board

Indexed keywords

JITTER; LIGHT TRANSMISSION; OPTICAL WAVEGUIDES; PRINTED CIRCUIT BOARDS;

DIRECT COUPLING; PLUGGABLE OPTICAL BOARD INTERCONNECTION SYSTEM; POLYMERIC WAVEGUIDE; TRANSMISSION LOSS;

OPTICAL INTERCONNECTS;

EID: 41849092680     PISSN: 10411135     EISSN: None     Source Type: Journal    
DOI: 10.1109/LPT.2008.918876     Document Type: Article

References (13)

1. S. H. Ahn, I. K. Cho, S. P. Han, K. B. Yoon, and M. S. Lee, "Demonstration of high-speed transmission through waveguide-embedded optical backplane," J. Opt. Eng., vol. 45, no. 8, pp. 805401-1-805401-6, Aug. 2006.
2. J. H. Choi, L. Wang, H. Bi, and R. T. Chen, "Effects of thermal-via structures or thin-film VCSELs for fully embedded board-leveloptical interconnection system," IEEE J. Sel. Topics Quantum Electron., vol. 12, no. 5, pp. 1060-1065, Sep./Oct. 2006.
3. G. Chen, H. Chen, M. Haurylau, N. Nelson, D. Albonesi, P. Fauchet, and E. Friedman, "On-chip copper-based versus optical interconnect: Delay uncertainty, latency, power, and bandwidth density comparative predictions," in IEEE Int. Interconnect Technol. Conf., Jun. 2006, pp- 39-41.
4. C. Berger, M. Kossel, C. Menolfi, T. Morf, T. Toifl, and M. Schmatz, "High-density optical interconnects within large-scale systems," Proc. SPIE, vol. 4942, pp. 222-235, 2003.
5. M. Haurylau, G. Chen, H. Chen, J. Zhang, N. Nelson, D. Albonesi, E. Friedman, and P. Fauchet, "On-chip optical interconnect roadmap: Challenges and critical directions," IEEE J. Sel. Topic, Quantum Electron., vol. 12, no. 6, pp. 1699-1705, Nov./Dec. 2006.
6. F. Strzelecka, D. Louderback, B. Thibeault, G. Thompson, K. Bertilsson, and L. Coldren, "Paralle, free-space optical interconnect based on arrays of vertical-cavity lasers and detectors with monolithic microlenses," Appl. Opt., vol. 37, no. 14, pp. 2811-2821, 1998.
7. H. Cho, S. Kang, M. Cho, B. Rho, H. Park, K. Shin, S. Ha, B. Rhee, D. Kim, S. Jung, and T. Kim, "Optical interconnection using fiber-embedded boards and connection blocks fabricated by a micro-grooving technique for fiber insertion," J. Micromech. Microeng., vol. 14, pp. 1181-1184, 2004.
8. G. Bona, B. Offrein, U. Bapst, C. Berger, R. Beyeler, R. Budd, R. Dangel, L. Dellmann, arid F. Horst, "Characterization of parallel optical-interconnect waveguides integrated on a printed circuit board," Proc. SPIE, vol. V5453, pp. 134-141, 2004.
9. T. Yoshikawa, I. Hatakeyama, K. Miyoshi, K. Kurata, J. Sasaki, N. Kanni, T. Sugimoto, M. Fulkaishi, K. Nakamura, K. Tanaka, H. Nishi, and T. Kudoh, "Optical-interconnection as an IP macro of a CMOS library," Proc. Hot Interconnects, vol. 9, pp. 31-35, 2001.
10. A. Glebov, M. Lee, and K. Yokouchi, "Integration technologies for pluggable backplane optical interconnect systems," J. Opt. Eng., vol. 46, no. 1, pp. 015403-1-015403-10, Jan. 2007.
11. K. B. Yoon, C. G. Choi, and S. P. Han, "Fabrication of multimode polymeric waveguides by hot embossing lithography," Jpn. J. Appl. Phys., vol. 43, no. 6A, pp. 3450-3451, 2004.
12. T. Xu, M. Zach, Z. Xiao, D. Rosenmann, U. Welp, W. Kwok, and G. Crabtree, "Self-assembled monolayer-enhanced hygrogen sensing with ultrathin palladium films," Appl. Phys. Lett., vol. 86, pp. 203104-1-1.03104-3, 2005.
13. K. B. Yoon, I. K. Cho, and S. H. Ahn, "10-Gb/s data transmission experiments over polymeric waveguides with 850-nm wavelength multimode VCSEL array," IEEE Photon. Technol. Lett., vol. 16, no. 9, pp. 2147-2149, Sep. 2004.