Sintered reaction-bonded silicon nitride with high thermal conductivity and high strength

International Journal of Applied Ceramic Technology

Volumn 5, Issue 2, 2008, Pages 119-126

  Zhou, You ^a   Zhu, Xinwen ^a,c   Hirao, Kiyoshi ^a   Lences, Zoltan ^b  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^b INSTITUTE OF CHEMISTRY   (Slovakia)

^c NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING STRENGTH; CERAMIC MATERIALS; MICROSTRUCTURE; PHASE COMPOSITION; SINTERING; THERMAL CONDUCTIVITY;

SINTERED REACTION-BONDED SILICON NITRIDE;

SILICON NITRIDE;

EID: 41749100400     PISSN: 1546542X     EISSN: 17447402     Source Type: Journal    
DOI: 10.1111/j.1744-7402.2008.02187.x     Document Type: Article

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