Assembly of fine-pitch carbon nanotube bundles for electrical interconnect applications

Materials Research Society Symposium Proceedings

Volumn 990, Issue , 2007, Pages 275-280

  Zhu, Lingbo ^a   Hess, Dennis W ^a   Wong, Chingping ^a  

^a Georgia Institute of Technology   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CONTACT RESISTANCE; GROWTH (MATERIALS); GROWTH TEMPERATURE; INTERCONNECTION NETWORKS; MICROELECTRONICS;

CARBON NANOTUBE BUNDLES; ELECTRICAL INTERCONNECTS; NANOTUBE GROWTH;

CARBON NANOTUBES;

EID: 41549088031     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-0990-b10-01     Document Type: Conference Paper

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