Silicon based system-in-package: Breakthroughs in miniaturization and 'nano'-integration supported by very high quality passives and system level design tools

Materials Research Society Symposium Proceedings

Volumn 969, Issue , 2007, Pages 27-36

  Murray, Franck ^a   LeCornec, François ^a   Bardy, Serge ^a   Bunel, Catherine ^a   Verhoeven, Jan ^b   Van Den Heuvel, F C M ^b   Klootwijk, J H ^b   Roozeboom, Fred ^b  

^a NXP SEMICONDUCTORS   (France)

^b NXP SEMICONDUCTORS   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

MOS CAPACITORS; PASSIVE NETWORKS; PORTABLE EQUIPMENT; SILICON WAFERS; WIRELESS TELECOMMUNICATION SYSTEMS;

ELECTRONIC APPLIANCES; SYSTEM IN PACKAGE (SIP); SYSTEM ON CHIP (SOC); SYSTEM-IN-PACKAGE;

CHIP SCALE PACKAGES;

EID: 40949148584     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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