A highly miniaturized 2.4 GHz bluetooth™ radio utilizing an advanced system-in-package technology

Conference Proceedings - 7th European Conference on Wireless Technology, ECWT2004

Volumn , Issue , 2004, Pages 169-172

  Philippe, Pascal ^a   Oruk, Atila ^a  

^a NXP SEMICONDUCTORS   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITORS; ENERGY UTILIZATION; FLIP CHIP DEVICES; INTEGRATED CIRCUITS; MIM DEVICES; RADIO FREQUENCY AMPLIFIERS; TRANSCEIVERS; VOLTAGE CONTROL;

BLUETOOTH; MINIATURIZATION; RADIO TRANSCEIVERS; SYSTEM-IN-PACKAGE TECHNOLOGY;

RADIO SYSTEMS;

EID: 19644392005     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. F.Roozeboom, A.Kemmeren, J.Verhoeven, F.van den Heuvel, H.Kretschman and T.Fric, "High-Density, Lowloss MOS Decoupling Capacitors integrated in a GSM Power Amplifier", Mat. Res. Soc. Symp. Proc. 783, 157-162 (2003)
2. A. Bart Smolders, Nick J. Pulsford, Pascal Philippe, Freek E. van Straten "RF SiP: The Next Wave for Wireless System Integration", RF-IC Symposium 2004