Effect of annealing on preferred orientations in the Cu/SiO2 and Cu/SiO2/Si(1 0 0) interfaces

Materials Science and Engineering: A

Volumn 479, Issue 1-2, 2008, Pages 112-116

  Bagalagel, S ^a   Shirokoff, J ^a  

^a MEMORIAL UNIVERSITY OF NEWFOUNDLAND   (Canada)

Author keywords

Copper; Nano microcrystals; Pole figures; Thin films; XRD

Indexed keywords

ANNEALING; CRYSTAL ORIENTATION; INTERFACES (MATERIALS); MICROCRYSTALS; MORPHOLOGY; RECRYSTALLIZATION (METALLURGY); THIN FILMS;

NANO-MICROCRYSTAL; POLE FIGURE;

COPPER ALLOYS;

ANNEALING; COPPER ALLOYS; CRYSTAL ORIENTATION; INTERFACES (MATERIALS); MICROCRYSTALS; MORPHOLOGY; RECRYSTALLIZATION (METALLURGY); THIN FILMS;

EID: 40749147117     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2007.06.032     Document Type: Article

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